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TS2000-SE-Automated-Probe-System-DS

MPI        TS2000-SE 

FEATURES / BENEFITS

 

img1

Designed for a Wide Variety of

On-Wafer Measurement Applications

       Device Modeling - DC-IV / DC-CV / Pulse-IV

       RF and mmW - RF Setup from 26 GHz to 110 GHz & beyond

       Failure Analysis - Probe card / Internode Probing

       Wafer Level Reliability - Hot / Cold / Long-term test

       High Power Device - Up to 10 kV / 600 A

 

MPI ShielDEnvironment™ for Accurate Measurements

       Designed for Advanced EMI / RFI / Light-Tight Shielding

       fA low-leakage capabilities

       Ready for temperature range -60 °C to 300 °C

 

Ergonomic Design and Options

       Front and advanced automated single wafer side loading capability with easy pre-alignment for automated routines

       Vertical Control Environment (VCE™) with observation of the probing area from the side for safe operation

       Integrated active vibration isolation

       Completely integrated prober control for faster, safer and convenient system and test operation

       The Safety Test Management (STM™) option to load/un- load wafers at any chuck temperatures and auto dew point control

SPECIFICATIONS

 

Chuck XY Stage (Programmable)

Travel range        210 x 300 mm (8.27 x 11.81 in)

Resolution        0.5 µm

Accuracy        ± 2.0 µm

Repeatability        ± 2.0 µm

Speed*

XY stage drive        High resolution stepper motor with linear encoder feedback system 4-Speed XY chuck stage adjustable speed movement

Slowest: 10 µm / sec | Fastest: 50 mm / sec

 

 

Chuck Z Stage (Programmable)

Travel range        50 mm (2 in)

Resolution        0.2 µm

Accuracy        ± 2.0 µm

Repeatability        ± 1.0 µm

Z stage drive

High resolution stepper motor with integrated pin drive system for easy wafer loading

Speed*

3-Speed Z chuck stage adjustable speed movement Slowest: 10 µm / sec | Fastest: 4 mm / sec

 

*The speed is instantaneous speed, not average speed. There is accelerate and decelerate time when moving.

 

 

 

SPECIFICATIONS

 

Chuck Theta Stage (Programmable)

Travel range        ± 6.0°

Resolution        0.0008°

Accuracy        < 2.0 µm (measured at the edge of the 200 mm chuck)

Repeatability        < 2.0 µm (measured at the edge of the 200 mm chuck)

Theta stage drive        High resolution stepper motor with linear encoder feedback system

 

Video Camera (Vertical Control EnvironmentTM)

Sensor type        1/1.8" mono CCD

Sensor size        7.16 mm x 5.44 mm

Camera pixels        2 M

Shutter type        Global shutter

 

 

Wafer Alignment Camera

Sensor type        1/1.8" color CCD

Sensor size        7.16 mm x 5.44 mm

Camera pixels        2 M

Shutter type        Global shutter

 

 

PROBE PLATEN

 

Specifications

Material        Nickel plated steel

Chuck to ShielDGuard height        min. 5 mm

Feature        Integrated Air-Cool platen control for thermal stability of MicroPositioners

Max. No of MicroPositioners        8 DC or 4 DC + 2 RF or 2DC + 4 RF Setup

440

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

220

Optional MPI MP25 MicroPositioners are shown with the drawing

 

 

 

ShielDEnvironment™

MPI ShielDEnvironment™ is a high performance local environmental chamber providing excellent EMI- and light- tight shielded test environment for ultra-low noise, low capacitance measurements.

MPI ShielDEnvironment™ allows up to 4-port RF or up to 8-ports DC/Kelvin or a combination of those configu- rations. MPI ShielDCap™ provides easy reconfiguration of measurement setup as well as EMI/noise shielding

- which make great difference in simplifying day to day operations.

 

ShielDEnvironment™ Electrical Specifications

EMI shielding        > 30 dB (typical) @ 1 kHz to 1 MHz

Light attenuation        ≥ 130 dB

Spectral noise floor        ≤ -180 dBVrms/rtHz (≤ 1 MHz)

System AC noise        ≤ 5 mVp-p (≤ 1 GHz)

 

 

img2KEY FEATURES

 

 

Automated Single Wafer Loader

Convenient wafer loading with easy pre-alignment for automated routines. Loading or unloading of 100, 150 or 200 mm wafer is straight forward and intuitive.

 

 

 

 

 

img3Wafer Hot Swap

The automated single wafer loader and the Safety Test Management (STM™) provide a unique capability to load/unload wafers at any chuck temperature. Cooling down or heating up to ambient is not required anymore for loading or unloading the wafer.

 

 

 

img4

Safety Test Management STM™ Option

The STM™ system prevents opening of any doors during testing. Accidental opening of any system door during a ne- gative chuck temperature is impossible on any event.

Furthermore, an intelligent dew point control routine avoids moisture condensation during cold testing. The system automatically monitors the flow of CDA or Nitro- gen. If the flow is interrupted or insufficient, the STM™ automatically turns the chuck into a safe mode by hea- ting up the chuck as fast as possible to 60 °C.

 

 

 

 

 

img5

Integrated Active Vibration Isolation

Highly effective vibration insulation with automatic le- vel controlled air-spring damping system.

Internal frequency: 2.5 Hz Automatic load leveling.

 

 

 

 

 

 

img6Vertical Control EnvironmentTM (VCE) Observation of the probing area from the side for safe operation.

 

 

 

 

 

 

Minimized CDA Consumption

With the ERS patented technology, using the chiller for purging the ShielDEnvironmentTM, the CDA consumpti- on is reduced by as much as 50%. Nitrogen purging is still possible by using separate valve.

 

 

 

 

 

img7Thermal Chuck Operation

The thermal chuck can be operated by using the ful- ly integrated touchscreen display, which is placed at a convenient location in front of the operator for fast operation and immediate feedback.

 

 

 

 

img8

Integrated Prober Control

The hardware system controller is completely integra- ted into the probe system and designed to provide fas- ter, safer and a more convenient probe system control and test operation. The keyboard and mouse are stra- tegically located to control the software if necessary, as well as the Windows® based instrumentation.

 

 

 

SOFTWARE SOLUTION

 

 

MPI‘s automated engineering probe systems are con- trolled by the unique and revolutionary, multi-touch operation SENTIO® Software Suite: simple and intu- itive operation saves significant training time. The scroll, zoom, and move commands mimic modern smart mobile devices and allows everyone to become an expert in just minutes. Switching between the acti- ve application and the other APPs is just a matter of a simple finger sweep.

 

img9

DC PROBES - SELECTION GUIDE

By implementing intuitive multi-touch operation, QAlibria® provides crisp and clear guidance to the RF calibration process, minimizes configuration mistakes and helps to reach accurate calibration results the fas- test. QAlibria® offers industry standard and advanced calibration methods.

Additionally, QAlibria® is integrated with NIST Statisti- Cal calibration packages providing easy access to the NIST multiline TRL metrology-level calibration and uncertain analysis.

img10

 

 

 

 

Coax Probe (PA-C)        Triax Probe (PA-T)        Kelvin Probe (PA-K)

Max voltage        500 V        500 V        500 V

Triaxial

Temperature range        -60 °C to 300 °C                        -60 °C to 300 °C                -60 °C to 300 °C Leakage current                < 0.8 pA                                < +/- 20fA                        < +/- 10fA Connectivity                        SMB                Standard Triax                                SSMC Connectivity type        Single Coaxial        Single low noise Triaxial        Force/Sense low noise

 

Characteristics impedance

50 Ohms        50 Ohms        50 Ohms

 

Brass        Brass

Residual capacitance        < 95 fF        < 95 fF        < 95 fF

 

Probe holder material

Brass

(Fully Guarded to the Tips)

 

Probe tips material                Tungsten                Tungsten                Tungsten Probe tips sizes        0.5 µm  25 µm        0.5 µm  25 µm        0.5 µm  5 µm

Minimum pad size        25 µm x 25 µm        25 µm x 25 µm        25 µm x 25 µm

img11

Typical MPI configuration with Kelvin Probes

 

 

Standard Wafer Chuck

Connectivity        Coax BNC (f)

Diameter        210 mm

Material        Stainless steel

Chuck surface        Planar with centric engraved vacuum grooves Vacuum grooves sections (diameter)        3, 27, 45, 69, 93, 117, 141, 164, 194 mm

mm diameter

Vacuum actuation        Multizone control - All connected in meander shape, center hole in 3

mm (8 in)*

Supported DUT sizes        Single DUTs down to 4 x 4 mm size or wafers 50 mm (2 in) thru 200 Surface planarity        ≤± 5 µm

Rigidity        < 15 µm / 10 N @edge

*Single DUT testing requires higher vacuum conditions dependent upon testing application.

 

RF Wafer Chuck

Connectivity        Kelvin Triax (f)

Material        Nickel plated aluminum (flat with 0.5 mm holes)

Diameter        210 mm with 2 integrated AUX areas

Chuck surface        Planar with 0.5 mm diameter holes in centric sections Vacuum holes sections (diameter)        3, 27, 45, 69, 93, 117, 141, 164, 194 mm

Vacuum actuation        Manual switch between Center (4 holes), 100, 150, 200 mm (4, 6, 8 in)

Supported DUT sizes        Single DUTs down to 4 x 4 mm size or wafers 100 mm (4 in) thru 200

mm (8 in)*

Surface planarity        ≤± 5 µm

Rigidity        < 15 µm / 10 N @edge

*Single DUT testing requires higher vacuum conditions dependent upon testing application.

 

Auxiliary Chuck

Quantity        2 AUX chucks

Position        Integrated to front side of main chuck

Substrate size (W x L)        Max. 25 x 25 mm (1 x 1 in)

Material        Ceramic, RF absorbing material for accurate calibration

Surface planarity        ≤± 5 µm

Vacuum control        Controlled independently, separate from chucks

 

Electrical Specification (Coax)

Operation voltage        In accordance with EC 61010, certificates for higher voltages available

upon request

 

Maximum voltage between chuck top and GND

500 V DC

 

Isolation        > 2 

 

Electrical Specification (Triax)

 

 

 

Standard Chuck (10 V)

 

Chuck isolation        > 100 

Force to guard        > 100 

Guard to shield        > 10 

Force to shield        > 50 

 

 

 

Temperature Range        20 °C to 200 °C

20 °C to 200 °C

20 °C to 300 °C

Connectivity        Coax

Kelvin Triax

Kelvin Triax

Temperature control method        Cooling air /

Cooling air /

Cooling air /

Resistance heater

Resistance heater

Resistance heater

Coolant        Air (user supplied)

Air (user supplied)

Air (user supplied)

Smallest temperature        0.1 °C

0.1 °C

0.1 °C

Chuck temperature        0.01 °C

0.01 °C

0.01 °C

External touchscreen        Yes

Yes

Yes

Temperature stability        ±0.08 °C

±0.08 °C

±0.08 °C

Temperature accuracy        0.1 °C

0.1 °C

0.1 °C

Control method        Low noise DC/PID

Low noise DC/PID

Low noise DC/PID

Interfaces        RS232C

RS232C

RS232C

Chuck surface plating        Nickel plated with

Nickel plated with

Nickel plated with

pinhole surface

pinhole surface

pinhole surface

Temperature sensor        Pt100 1/3DIN,

Pt100 1/3DIN,

Pt100 1/3DIN,

4-line wired

4-line wired

4-line wired

Temperature uniformity        < ±0.5 °C        < ±0.5 °C        < ±0.5 °C at 20 to 200 °C

< ±0.5 °C at > 200 °C

 

Specifications of MPI ERS Integrated Technology

 

 

 

 

 

 

selection step display resolution display operation

 

 

 

 

 

 

 

 

 

 

 

Surface flatness and

base parallelism

 

< ±10 µm        < ±10 µm        < ±10 µm

 

Heating rates        20 to 200°C < 15mm        20 to 200 °C < 20 min        20 to 300 °C < 30 min

Cooling rates*        200 to 20 °C < 20 min        200 to 20 °C < 25 min        300 to 20 °C < 30 min

 

> 300 G  at 200 °C

Electrical isolation - Coax BNC (f)        > 10 T  at 25 °C

N/A        N/A

 

< 30 fA at 200 °C

Leakage @ 10 V - Kelvin Triax (f)        N/A        < 15 fA at 25 °C

< 15 fA at 25 °C

< 50 fA at 300 °C

 

Capacitance        < 900 pF        N/A        N/A

 

Maximum voltage between chuck top and GND

*All data are relevant for chucks in ECO mode.

500 V DC        500 V DC        500 V DC

 

Specifications of MPI ERS Integrated Technology

Temperature Range

-10 °C to 200 °C/300 °C

-40 °C to 200 °C/300 °C

-60 °C to 200 °C/300 °C

Connectivity

Kelvin Triax

Kelvin Triax

Kelvin Triax

Temperature control

Cooling air /

Cooling air /

Cooling air /

method

Resistance heater

Resistance heater

Resistance heater

Coolant

Air (user supplied)

Air (user supplied)

Air (user supplied)

 

Smallest temperature selection step

Chuck temperature display resolution

External touchscreen display operation

0.1 °C        0.1 °C        0.1 °C

 

0.01 °C        0.01 °C        0.01 °C

 

Yes        Yes        Yes

 

Temperature stability        ±0.08 °C        ±0.08 °C        ±0.08 °C

Temperature accuracy                        0.1 °C                        0.1 °C                        0.1 °C Control method        Low noise DC/PID        Low noise DC/PID        Low noise DC/PID Interfaces                RS232C                RS232C                RS232C

 

Chuck surface plating Temperature sensor

Temperature uniformity

Surface flatness and

Nickel plated with pinhole surface

Pt100 1/3DIN,

4-line wired

< ±0.5 °C at

-60 to 200 °C

Nickel plated with pinhole surface

Pt100 1/3DIN,

4-line wired

< ±0.5 °C at

-60 to 200 °C

Nickel plated with pinhole surface

Pt100 1/3DIN,

4-line wired

< ±0.5 °C at

-60 to 200 °C

 

N/A        N/A        N/A

base parallelism        < ±10 µm        < ±10 µm        < ±10 µm Electrical isolation

Coax BNC (f) Heating rates

 

 

 

 

 

Cooling rates*

Leakage @ 10 V Kelvin Triax (f)

 

-60°C        --

--

< 30 fA

 

 

-40°C        --

< 30 fA

< 30 fA

 

 

-10°C        < 30 fA

< 30 fA

< 30 fA

 

 

25°C        < 15 fA

< 15 fA

< 15 fA

 

 

200°C        < 30 fA

< 30 fA

< 30 fA

 

 

300°C        < 50 fA

< 50 fA

< 50 fA

 

 

 

 

 

 

 

Capacitance        N/A

N/A

N/A

 

 

Maximum voltage between chuck top and GND

*All data are relevant for chucks in ECO mode.

500 V DC        500 V DC        500 V DC

 

 

 

STANDARD ERS THERMAL CHUCKS

 

Specifications of ERS Technology

Temperature Range

 

-10 °C to 200 °C

 

-40 °C to 200 °C

 

-60 °C to 200 °C

Connectivity

SingleTriax

SingleTriax

SingleTriax

 

 

Resistance heater

Resistance heater

Resistance heater

Coolant

Air (user supplied)

Air (user supplied)

Air (user supplied)

Smallest temperature selection step

0.1 °C

0.1 °C

0.1 °C

Chuck temperature display resolution

0.01 °C

0.01 °C

0.01 °C

External touchscreen display operation

Yes

Yes

Yes

Temperature stability

±0.08 °C

±0.08 °C

±0.08 °C

Temperature accuracy

0.1 °C

0.1 °C

0.1 °C

Control method

Low noise DC/PID

Low noise DC/PID

Low noise DC/PID

Interfaces

RS232C

RS232C

RS232C

Chuck surface plating        vNickel plated with        vNickel plated with        vNickel plated with

acuum groove lines        acuum groove lines        acuum groove lines

Temperature sensor

Pt100 1/3DIN, 4-line wired

Pt100 1/3DIN, 4-line wired

Pt100 1/3DIN, 4-line wired

Temperature uniformity

< ±0.5 °C at

-60 to 200 °C

< ±0.5 °C at

-60 to 200 °C

< ±0.5 °C at

-60 to 200 °C

 

Surface flatness and base parallelism

< ±10 µm

< ±10 µm

< ±10 µm

 

Electrical isolation - Coax BNC (f)

N/A

N/A

N/A

 

Heating rates

 

 

 

 

25 °C

-10 to 25°C < 5 min

-40 to 25°C < 8 min

-60 to 25°C < 12 min

 

200 °C

 

25 to 200 °C < 15 min

 

 

Cooling rates*

 

 

 

 

 

Temperature control method        Cooling air /

Cooling air /

Cooling air /

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

200 °C

 

200 to 25°C < 12 min

 

25 °C

25 to -10°C < 12 min

25 to -40°C < 18 min

25 to -60°C < 25 min

 

 

 

Isolation

> 10 TΩ at 25 °C

> 2.5 TΩ at 200 °C

> 2.5 TΩ at -10 °C

> 10 TΩ at 25 °C

> 2.5 TΩ at 200 °C

> 2.5 TΩ at -40 °C

> 10 TΩ at 25 °C

> 2.5 TΩ at 200 °C

> 2.5 TΩ at -60 °C

Capacitance

N/A

N/A

N/A

Maximum voltage between chuck top        500 V DC        500 V DC        500 V DC and GND

*All data are relevant for chucks in ECO mode.

 

System Controller / Chiller Dimensions and Power / Air Consumption

 

System type

W x D x H (mm)

Weight (kg)

Power cons. (VA)

max. Air flow*(l/min)

20 to 200 °C / 300 °C

300 x 360 x 135

12

700

200

-10 to 200 °C / 300 °C

420 x 300 x 520

45

1350

220

-40 to 200 °C / 300 °C

420 x 500 x 1020

140

2100

380

-60 to 200 °C / 300 °C

420 x 500 x 1020

140

2100

380

*All data are relevant for chucks in ECO mode.

 

 

 

 

img12        img13

 

ERS AirCool® (patented) Controller Integrated Chiller -40°C / -60°C

ERS AirCool® (patented) Controller Integrated Chiller -10°C

 

 

TYPICAL TRANSITION TIME

 

 

 

250

AC3 200 mm +20°C to +200°C

 

350

AC3 200 mm +20°C to +300°C

 

 

temperature [°C]

200

 

150

 

100

 

50

 

300

 

temperature [°C]

250

 

200

 

150

 

100

 

50

 

 

0

0        5 10 15 20 25 30 35 40 45

time [min]

 

0

0 5 10 15 20 25 30 35 40 45 50 55 60

time [min]

 

 

 

 

250

 

200

 

temperature [°C]

150

 

100

AC3 200mm -60°C to +200°C

 

 

350

 

300

 

250

 

temperature [°C]

200

 

150

 

AC3 200mm -60°C to +300°C

 

50

 

0

 

-50

 

-100

 

 

 

 

 

 

 

 

 

 

0 5 10 15 20 25 30 35 40

time [min]

 

 

 

 

 

 

 

 

 

 

45 50 55 60

 

100

 

50

 

0

 

-50

 

-100

 

 

 

 

 

 

 

 

 

 

0 5 10 15 20 25 30 35 40 45 50

time [min]

 

 

 

 

 

 

 

 

 

 

55 60

 

 

 

FACILITY REQUIREMENTS

System Controller Specifications

CPU        Intel Core i5 4570s 2.9GHz

RAM        DDR3 1600 8GB

64 bit operating system        Windows 7 Professional or later Power        460 W

Hard disk drive        1TB SATA3 x1

USB ports        Internal (on PC) x3, external x1

External display card        x1

CD / DVD ROM        N/A

GPIB card        Optional

 

General Probe System

Power        100-240 V AC nominal ; 50/60 Hz

Vacuum        -0.9 bar

Compressed air        6.0 bar

 

Thermal Chuck Electrical Supply

Electrical primary connection        100 to 240 VAC auto switch Electrical frequency        50 Hz / 60 Hz

Operating pressure        6.0 bar (0.6 MPa, 87 psi) at specified flow rate

CDA dew point

≤ 0 °C for hot chuck system (ambient to 300 °C)

≤ -45 °C for hot and cold chuck system (-60 °C to 300 °C)

 

 

Supported software platforms

Emulation mode        Available for various prober control software*

 

*       Please contact your local support for more details.

 

REGULATORY COMPLIANCE

       CE certified. TÜV compliance tested according to EN 61010, ISO 12100, and SEMI S2

 

WARRANTY

       Warranty*: 12 months

       Extended service contract: contact MPI Corporation for more information

 

 

 

 

 

 

 

 

 

 

 

*See MPI Corporation‘s Terms and Conditions of Sale for more details.

 

 

img14Specifications

System Dimensions (W x D x H)        1180 x 970 x 1450 mm (46.5 x 38.2 x 57.1 in)

Weight        650 kg (includes anti-vibration table and system accessories)

img15

*Can vary depends on monitor/chiller position.

 

 

1450+(145*)

1000

1740*

1530

690

500

1530*

600

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

img16

1080

970

 

 

Direct contact:

Asia region:                ast-asia@mpi-corporation.com EMEA region:        ast-europe@mpi-corporation.com America region: ast-americas@mpi-corporation.com

MPI global presence: for your local support, please find the right contact here:

www.mpi-corporation.com/ast/support/local-support-worldwide

 

MPI Global Presence

 

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200 mm Automated Probe System
For accurate and reliable DC/CV, RF and mmW measurements

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