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TS200-THZ-Manual-Probe-System-DS



MPI        TS200-THZ | 200 mm Manual Probe System

For accurate measurements at mm-wave and sub-mm wave (THz) range



img1FEATURES / BENEFITS

Ergonomic Design

       Unique puck controlled air bearing stage for quick single-handed operation

       Rigid and large platen accommodates large area MicroPositioners, holding mmw extenders

       Highly repeatable platen lift design with three discrete positions for contact, separa- tion, and loading


Upgradability

       Available with various chuck options, PCB holder and a wide range of accessories such as DC/RF/THz MicroPositioners, Optics, and microscopes to support various application requirements


SPECIFICATIONS

Chuck XY Stage (Standard)

Total travel range        255 x 325 mm (10.0 x 12.8 in)


Fine-travel range        25 x 25 mm fine micrometer control

Fine-travel resolution        < 1.0 µm (0.04 mils) @ 500 µm/rev

Planarity        < 10 µm

Theta travel (standard)        360°

Theta travel (fine)        ± 5.0°

Theta resolution        7.5 x 10-3 gradient

Movement        Puck controlled air bearing stage



Chuck Z Stage

Travel range        10 mm (0.4 in)

Fine-travel resolution        < 1.0 µm (0.04 mils) @ 500 µm/rev, with digital indicator



Manual Microscope Stage (Linear)

Movement range        50 x 50 mm (2 x 2 in) or 80 x 80 mm (3.15 x 3.15 in)

Resolution        < 5µm (0.2 mils)

Scope lift        Manual, tilt-back or vertical (depending on microscope type)

Movement        Independently controlled X and Y movement with locking screws





img2PROBE PLATEN

Specifications

Design        For unsurpassed stability: low profile, four pole support


img3Material        Nickel plated steel

Dimension        Large area platen, see drawing

img4Chuck top to platen top        Min. 28 mm

Max. No of MicroPositioners        2x mmW E/W + 2x RF N/S and 4x DC or 2x mmW E/W + 8x DC

img5Platen lift control        3 positions - contact (0), separation (300 µm), and loading (3 mm)

Separation repeatability        < 1 µm (0.04 mils) by „automated“ control

img6mmW MicroPositioner mounting        Bolt down

RF MicroPositioner mounting        Magnetic with guided rail

110.5

124

DC MicroPositioner mounting        Magnetic

img7


















109.5

Probe Platen design for DC, RF and THz MicroPositioners


img8PROBE HOVER CONTROLTM

Unique platen lift with Probe Hover Control™ - hover heights of 50, 100 or 150 μm for easy and convenient probe

to pad alignment.

img9img10img11




Frequency Extender Adaptation

Seamless integration of any frequency extenders for best measurement directivity at 200 mm wafers.

img12img13


NON-THERMAL CHUCKS

RF Wafer Chuck

Connectivity        Kelvin Triax (f)

Material        Nickel Plated Aluminium (flat with 0.5 mm holes)

Diameter        210 mm with 2 integrated AUX areas

Chuck surface        Planar with 0.5 mm diameter holes in centric sections Vacuum holes sections (diameter)        3, 27, 45, 69, 93, 117, 141, 164, 194 mm

(8 in)*

Vacuum actuation        Manual switch between Center (4 holes), 100, 150, 200 mm (4, 6, 8 in) Supported DUT sizes        Single DUTs down to 4 x 4 mm size or wafers 100 mm (4 in) thru 200 mm

Surface planarity        ≤± 5 µm

Rigidity        < 15 µm / 10 N @edge

Electrical Specification

upon request

Operation voltage        In accordance with EC 61010, certificates for higher voltages available

Isolation        > 2 


*Single DUT testing requires higher vacuum conditions dependent upon testing application.


Auxiliary Chuck

Quantity        2 AUX chucks

Position        Integrated to rear side of main chuck

Substrate size (W x L)        Max. 25 x 25 mm (1 x 1 in)

Material        Ceramic, RF absorbing material for accurate calibration

Surface planarity        ≤± 5 µm

Vacuum control        Controlled independently, separate from chucks











img14MPI auxiliary chucks made by ceramic



Specifications of MPI ERS Integrated Technology


35 °C to 150 °C

20 °C to 200 °C

25 °C to 150 °C

Maximal wafer size

200 mm

200 mm

25 x 25 mm Single IC

Connectivity

Coax BNC (f)

Coax BNC (f)

Coax BNC (f)

Temperature control method        R Cooling air / er        R Cooling air / er        Peltier heater

esistance heat        esistance heat

Coolant        Air (user supplied)        Air (user supplied)        Air (max. 50 l/min)



Chuck temperature display resolution

0.1 °C        0.01 °C        0.1 °C
















External touchscreen display operation

N/A

Yes

N/A

Temperature stability

±0.5 °C

±0.08 °C

±0.2 °C

Temperature accuracy

±1 °C

0.1 °C

±1 °C

Control method

DC/PID

Low noise DC/PID

DC/PID

Interfaces

RS232C

RS232C

RS232C

Chuck surface plating

Nickel plated with pinhole surface

Nickel plated with pinhole surface

Gold plated with pinhole surface

Temperature sensor        Pt100 1/3DIN

Pt100 1/3DIN,

4-line wired

Pt100 1/3DIN,

4-line wired

Temperature uniformity        < ±1 °C

< ±0.5 °C

< ±0.5 °C

Surface flatness and        < ±15 µm

< ±10 µm

< ±15 μm

Heating and cooling rates        35 to 150 °C < 10 min

20 to 200°C < 12 mins

25 to 150 °C < 6 min

150 to 35 °C < 15 min

200 to 20°C < 15 mins

150 to 25 °C < 6 min

Electrical isolation        > 0.5 T  at 25 °C

Coax BNC (f)

> 10 T Ω at 25 °C

> 300 G Ω at 200 °C

> 0.5 T Ω at 25 °C

Leakage @ 10 V        N/A

N/A

N/A

Capacitance        < 750 pF

< 900 pF

< 750 pF

Maximum voltage between        500 V DC

500 V DC

500 V DC


base parallelism





Kelvin Triax (f)



chuck top and GND


img15img16

Dedicated ERS thermal chuck system for testing single ICs


img17

210

Thermal Chuck Electrical Supply

img18Electrical Supply        Hot only thermal chucks Electrical primary connection        100 to 240 VAC auto switch Frequency        50 Hz / 60 Hz

Operating pressure        6.0 bar (0.6 MPa, 87 psi) at specified flow rate

Compressed Air Supply

CDA dew point        ≤ 0 °C

img19


Controller Dimensions / Power and Air Consumption

System Type

W x D x H (mm)

Weight (kg)

Power Cons. (VA)

max. Air Flow (l/min)

35 to 150 °C

300 x 265 x 135

10

500

200

20 to 200 °C

300 x 360 x 135

12

700

200

25 to 150 °C

300 x 261 x 135

3.3

100

50


img20General Probe System

Power        100-240 V AC 50/60 Hz for optical accessories* only

img21Vacuum        -0.5 bar (for single DUT) / -0.3 bar (for wafers)

Compressed air        6.0 bar

*e.g. microscope illumination, CCD cameras, monitors.


img22WARRANTY

       Warranty*: 12 months

       Extended service contract: contact MPI Corporation for more information

*See MPI Corporation‘s Terms and Conditions of Sale for more details.


img23PHYSICAL DIMENSIONS


Station Platform with Bridge*

img24Dimensions (W x D x H)        670 x 680 x 710 mm (26.4 x 26.8 x 28.0 in)

Weight        ~120 kg (265 lb.)

img25

710

680

770

*Station accessories, such as different microscopes, cameras, or laser cutters, may change the total height.




Vibration Isolation Table

Standard        Advanced


img26

Dimensions (W x D x H)

900 x 800 x 835 mm

(35.4 x 31.5 x 32.9 in)

900 x 800 x 830 mm

(35.4 x 31.5 x 32.7 in)


img27Feature        Adjustable air damping system                Automatic load leveling Keyboard / Mouse Tray Included                Yes

img28Front Protection Bar        Yes

Castors Included        Yes

img29Shelves Included        Upper and Lower

Accessories Accepted        Monitor Stand(s) and Instrument Shelf

Weight        Approx. 210 kg ( 463 lb.)        Approx. 210 kg ( 463 lb.)

img30




STD 835  5

ADV 830  5

750

800

800
































img31MPI Global Presence



Direct contact:

Asia region:                ast-asia@mpi-corporation.com EMEA region:        ast-europe@mpi-corporation.com America region: ast-americas@mpi-corporation.com

MPI global presence: for your local support, please find the right contact here:

www.mpi-corporation.com/ast/support/local-support-worldwide

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