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TS150-Probe-Station-DS



MPI        TS150 | 150 mm Manual Probe System

For accurate and reliable DC/CV, RF and High Power measurements


FEATURES / BENEFITS


img1Universal Use

       Designed for wide variety of applications such as Device Characterization and Modeling, Wafer Level Reliability, Failure Analysis, IC Engineering, MEMS and High Power


Ergonomic Design

       Unique puck controlled air bearing stage for quick single-handed operation

       Rigid platen accommodates up to 10 DC or 4 RF

positioners

       Highly repeatable platen lift design with three discrete positions for contact, separation, and loading


Upgradability

       Available with various chuck options and wide range of accessories such as DC/RF/mmW Micro- Positioners, Optics, microscopes and EMI shielded dark box to support various application require- ments




SPECIFICATIONS


Total travel range        180 x 230 mm (7.1 x 9.1 in)

Chuck XY Stage (Standard)

Fine-travel range        25 x 25 mm fine micrometer control

Fine-travel resolution        < 1.0 µm (0.04 mils) @ 500 µm/rev

Planarity        < 10 µm

Theta travel (standard)        360°

Theta resolution        7.5 x 10-3 gradient

Theta travel (fine)        ± 5.0°

Movement        Puck controlled air bearing stage



Optional XY Stage for TS150-ES

Planarity        < 10 µm (0.4 mils)

Movement        Easy puck controlled air bearing stage for TS150-ES

Theta travel (standard)        Free movement up to 360°

Fine adjustment        N/A





Manual Microscope Stage (Air Bearing)

Movement range        25 x 25 mm (1 x 1 in)

Resolution        N/A

Scope lift        Manual, tilt-back

Movement        Air bearing control, fixed by vacuum



Manual Microscope Stage (Linear)

Movement range        50 x 50 mm (2 x 2 in)

Resolution        < 5µm (0.2 mils)

Scope lift        Manual, tilt-back or vertical (depending on microscope type)

Movement        Independently controlled X and Y movement with locking screws



PROBE PLATEN

Specifications

Material        Nickel plated steel


Dimensions        See drawing

Chuck to platen height        Min. 10 mm

Max. No of MicroPositioners        10 DC and 4 RF

Platen lift control        3 positions - contact (0), separation (300 µm), and loading (3 mm)

Z-height adjustment range        Max. 20 mm (0.8 in)

Platen Z-height movement        High resolution screw for fine control

Separation repeatability        < 1 µm (0.04 mils) by „automated“ control

RF MicroPositioner mounting        Magnetic with guided rail

DC MicroPositioner mounting        Magnetic

105°

330

300 °C thermal isolation        Depends on chuck configuration

















Universal probe platen design for up to 10 DC MicroPositioners




NON-THERMAL CHUCKS

Standard Wafer Chucks

Connectivity 1        Coaxial chuck: Coax BNC (f)

Diameter        160 mm

Connectivity 2        Triaxial chuck: Kelvin Triax (f)

Material        Stainless steel

Chuck surface        Planar with centric engraved vacuum grooves Vacuum grooves sections (diameter)        3, 27, 45, 69, 93, 117, 141 mm

Vacuum actuation        Multizone control - All connected in meander shape, center hole in 3

mm diameter

Supported DUT sizes        Single DUTs down to 4 x 4 mm size or wafers 50 mm (2 in) thru 150

Surface planarity        ≤± 5 µm

mm (6 in)*

Rigidity        < 15 µm / 10 N @edge


*Single DUT testing requires higher vacuum conditions dependent upon testing application.

RF Wafer Chuck

Connectivity        Coax BNC (f)

Diameter        150 mm with 2 integrated AUX areas

Material        Nickel plated aluminum (flat with 0.5 mm holes)

Chuck surface        Planar with 0.5 mm diameter holes in centric sections Vacuum holes sections (diameter)        3, 27, 45, 69, 93, 117, 141 mm

Vacuum actuation        Manual switch between Center (4 holes), 50, 100, 150 mm (2, 4, 6 in)

Supported DUT sizes        Single DUTs down to 4 x 4 mm size or wafers 50 mm (2 in) thru 150

mm (6 in)*

Rigidity        < 15 µm / 10 N @edge

Surface planarity        ≤± 5 µm

*Single DUT testing requires higher vacuum conditions dependent upon testing application.

Auxiliary Chuck

Quantity        2 AUX chucks

Substrate size (W x L)        Max. 25 x 25 mm (1 x 1 in)

Position        Integrated to rear side of main chuck

Material        Ceramic, RF absorbing material for accurate calibration

Surface planarity        ≤± 5 µm

Vacuum control        Controlled independently, separate from chucks



Electrical Specification (Coax)

Operation voltage        In accordance with EC 61010, certificates for higher voltages available upon request

Maximum voltage between chuck and GND        500 V DC Isolation        > 2 


Electrical Specification (Triax)

Standard Chuck (10 V)

Chuck isolation        > 100 

Force to guard        > 100 

Guard to shield        > 10 

Force to shield        > 50 



Specifications of MPI ERS Integrated Technology



35 °C to 150 °C

20 °C to 200 °C

20 °C to 200 °C

20 °C to 300 °C

Connectivity

Coax BNC (f)

Coax BNC (f)

Kelvin Triax (f)

Single Triax (f)

Temperature control

Cooling air /

Cooling air /

Cooling air /

Cooling air /

method

Resistance heater

Resistance heater

Resistance heater

Resistance heater

Coolant

Air (user supplied)

Air (user supplied)

Air (user supplied)

Air (user supplied)


Smallest temperature selection step

0.1 °C        0.1 °C        0.1 °C        0.1 °C





display operation


Temperature stability

±0.5 °C

±0.08 °C

±0.08 °C

±0.08 °C

Temperature accuracy

±1 °C

0.1 °C

0.1 °C

0.1 °C

Control method

DC/PID

Low noise DC/PID

Low noise DC/PID

Low noise DC/PID

Interfaces

RS232C

RS232C

RS232C

RS232C

Chuck surface plating        Nickel plated with        Nickel plated with        Nickel plated with        Gold plated with pinhole surface                pinhole surface                pinhole surface                pinhole surface

Temperature sensor

Pt100 1/3DIN

Pt100 1/3DIN,

4-line wired

Pt100 1/3DIN,

4-line wired

Pt100 1/3DIN,

4-line wired

Temperature uniformity        < ±1 °C

< ±0.5 °C

< ±0.5 °C

< ±0.5 °C at 20 to 200 °C

< ±0.5 °C at > 200 °C

Surface flatness and        < ±15 µm

< ±10 µm

< ±10 µm

< ±10 µm

Heating and cooling rates        35 to 150 °C < 10 min

20 to 200 °C < 12 min

20 to 200 °C < 20 min

20 to 300 °C < 15 min

150 to 35 °C < 15 min

200 to 20 °C < 15 min

200 to 20 °C < 20 min

300 to 20 °C < 20 min

Electrical isolation Coax BNC (f)

> 0.5 T Ω at 25 °C

> 10 T Ω at 25 °C

> 300 G Ω at 200 °C

N/A

N/A

Leakage @ 10 V Kelvin Triax (f)

N/A

N/A

< 15 fA at 25 °C

< 30 fA at 200 °C

< 15 fA at 25 °C

< 50 fA at 300 °C

Capacitance

< 750 pF

< 900 pF

N/A

N/A

Maximum voltage between        500 V DC        500 V DC        500 V DC        500 V DC

chuck top and GND


External touchscreen

N/A        Yes        Yes        Yes















base parallelism










FACILITY REQUIREMENTS

Thermal Chuck Electrical Supply

Compressed Air Supply

Electrical primary connection        100 to 240 VAC auto switch Frequency        50 Hz / 60 Hz


Operating pressure        6.0 bar (0.6 MPa, 87 psi) at specified flow rate CDA dew point         0°C


Controller Dimensions / Power and Air Consumption

System Type

W x D x H (mm)

Weight (kg)

Power Cons. (VA)

max. Air Flow (l/min)

35 to 150 °C - Coax BNC (f)

300 x 265 x 135

10

500

150

20 to 200 °C - Coax BNC (f)

300 x 360 x 135

12

700

200

20 to 200 °C - Kelvin Triax (f)

300 x 360 x 135

12

700

200

20 to 300 °C - Single Triax (f)

300 x 360 x 135

12

700

200




img2General Probe System

Power        100-240 V AC nominal; 50/60 Hz for optical accessories* only

img3Vacuum        -0.5 bar (for single DUT) / -0.3 bar (for wafers)

Compressed air        6.0 bar

*e.g. microscope illumination, CCD cameras, monitors.


img4REGULATORY COMPLIANCE

       Certification: CE

img5WARRANTY

       Warranty*: 12 months

       Extended service contract: contact MPI Corporation for more information


img6PHYSICAL DIMENSIONS


Dimensions (W x D x H)        470 x 505 x 635 mm (18.5 x 19.9 x 25.0 in)

Station Platform with Bridge*

Weight        ~60 kg (132 lb.)

img7

*Station accessories, such as different microscopes, cameras, or laser cutters, may change the total height.



























635

240

505

580


*See MPI Corporation‘s Terms and Conditions of Sale for more details.



Direct contact:

Asia region:                ast-asia@mpi-corporation.com EMEA region:        ast-europe@mpi-corporation.com America region: ast-americas@mpi-corporation.com


MPI global presence: for your local support, please find the right contact here: www.mpi-corporation.com/ast/support/local-support-worldwide


MPI Global Presence


img8

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