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TS50-DS

MPI TS50 | 50 mm Manual Probe System

For accurate and reliable DC/CV and RF measurements



img1img2   FEATURES / BENEFITS

Flexible Platform

       Designed for research, development and academic use in IC engineering, single die probing

       Ideal platform for load pull and high frequency noise measurement

Ergonomic Design

       Solid and stable platform in small footprint (300 x 300 mm) design

       Rigid platen accommodates up to 6 DC or 2 RF positioners

       Simple operation for stage and microscope positioning

Upgradability

       Available with various chuck options and wide range of accessories such as DC/RF/mmW MicroPositioners, Optics, microscopes and EMI shielded dark box to support various application requirements





img3   SPECIFICATIONS


Chuck XY Stage (Standard)


Travel

100 x 75 mm (3.9 x 3.0 in)

Resolution

5.0 µm (0.2 mils)

Planarity

< 10 µm

Theta travel (standard)

360°

Theta travel (fine)

± 5.0°

Theta resolution

7.5 x 10-3 gradient

Movement control

Guided rail with instant lock mechanism

Fine adjustment

25 x 25 mm fine micrometer control


img4   PROBE PLATEN



Specifications


Material

Steel

Dimensions

250 mm (Inside), 408 mm (Outside)

Chuck to platen height

min. 5 mm

Max. No of MicroPositioners

6 DC and 2 RF

Platen Z-height movement

High resolution screw for fine control

Z-height adjustment range

Max. 25 mm (1 in)

DC positioner mounting

Magnetic

RF positioner mounting

Magnetic with guide rail



img5   NON-THERMAL CHUCKS


Standard Wafer Chuck


Diameter

56 mm

Material

Stainless steel

Supported DUT sizes

Shards or wafers 25 mm (1 in) through 50 mm (2 in)

Vacuum ring diameter

4, 16, 30, 44 mm

Vacuum ring actuation

Multizone control - All connected in meander shape, center hole 0.5 mm diameter

Chuck surface

Planar with centric engraved vacuum grooves

Surface planarity

≤± 5 µm

Rigidity

< 15 µm / 10 N @edge



RF Wafer Chuck


Diameter

50 mm with 1 integrated AUX area

Material

Stainless steel with HF/OPTO surface (flat with 0.5 mm holes)

Supported DUT sizes

Main - Single DUTs down to 3 x 5 mm size or wafers 25 mm (1 in) through 50 mm (2 in)

Vacuum hole sections (diameter)

4, 16, 30, 44 mm (four holes in center with 4 x 4 mm distance)

Vacuum holes actuation

Mechanically selected

Chuck surface

Planar with 0.5 mm diameter holes in centric sections

Surface planarity

≤± 5 µm

Rigidity

< 15 µm / 10 N @edge



Auxiliary Chuck


Quantity

1 AUX chuck

Position

Integrated to rear side of main chuck

Substrate Size (W x L)

Max. 25 x 25 mm (1.0 x 1.0 in)

Material

Ceramic, RF absorbing material for accurate calibration

Surface planarity

≤± 5 µm

Vacuum control

Controlled independently, separate from chucks


200


Electrical Specification (Coax)


Operation voltage

Standard - in accordance with EC 61010, certificates for higher voltages available upon request

Isolation

> 2 GΩ


img6   FACILITY REQUIREMENTS



Power

110 or 200-240 V AC 50/60 Hz for optical accessories* only

Vacuum

-0.5 bar

Compressed air

4 bar for vibration isolation options only

*       e.g. microscope illumination, CCD cameras, monitors


img7   REGULATORY COMPLIANCE

       Certification: CE


img8   WARRANTY

       Warranty*: 12 months

       Extended service contract: contact MPI Corporation for more information

*See MPI Corporation‘s Terms and Conditions of Sale for more details

img9   PHYSICAL DIMENSIONS


Station Platform with Bridge*


Dimensions (W x D x H)

300 x 300 x 445 mm (11.8 x 11.8 x 18.1 in)

Weight

~30 kg (66 lb.)

445

300

*Station accessories, such as dark box, cameras or laser cutters, may increase the total height to up to 794 mm (31.3 in).

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